2026.08.04 HP20 Smart Heating Station V1.8 (Chen Luojie)  
Optimized power setting method  
Procedure as follows:  
Settings menu → Power output → Power settings → Press and hold the right button to start blinking cursor: use left/right buttons to switch cursor position; press and hold the left button to exit power settings; press and hold the right button to stop blinking and begin adjusting power → After adjustment, press and hold the left button to exit power settings; press and hold the right button to return to previous step with cursor blinking


2026.07.17 V1.7 (Chen Luo jie)
Reflow Mode Updates
1，Low power error triggers on reflow entry when configured power < 100W
2，Friendly reminder pops up on reflow entry when configured power < 140W:
3，140W+ power supply recommended. Insufficient power degrades soldering performance.Heating timeout activates if target temp not reached in 10 minutes.[Press any key to continue]
4，Added background reflow heating timeout logic (no UI display). Protection triggers after 10 minutes of failing to reach target temperature in reflow phase.

2026.05.20 V1.6 (Chen Luo jie)
1，Fixed an issue reported by customers where the logo on the heating screen displayed abnormally in Traditional Chinese or English language environments, while it displayed normally in Simplified Chinese.

2026.01.08 V1.5(Chen Luo Jie)
1. During the T4 stage of heating, cooling and reflow soldering, when the fan is running at full speed, the icon will display as level 1.

2025.12.23 V1.4 (Chen Luo Jie)
1. Add real-time temperature display in the upper right corner of the icon menu interface and the settings interface.
2. When the input power is less than 100W, a warning will be prompted when entering the reflow soldering interface.
3. Add a sound prompt when the target temperature is reached. 

2025.12.6 V1.3 (Chen Luo Jie)
1. Modified the maximum temperature for the bonding mode to 260 degrees. 

2025.12.2 V1.2 (Chen Luo Jie)
1. Added 32V power meter 
After optimizing and changing the voltage, recalibrate the power. 
3. Address the customer's feedback that the reflow soldering process remains at 80 degrees after completion. 

2025.11.19 V1.1 (by Chen LuoJie)
1. First batch of firmware for mass production